RF (Radio Frequency Boards)

• Top to Bottom Alignment .0005" Same Layers
• Etching ±.0005" (1/2 Oz. Copper)
• .001" Spacing
• Measuring Capability for Coupling, Filters, Impendance, Differential Pair measurements in house

Power Amplifier Boards

• Mix Dielectric Multilayer
• Highly Thermally Conductive Materials
• Cavity under Power transistor launch area for RF Ground and edge plating
• Selective Plating
• Selective Edge Plating

Conductive Thermal or Electrical Adhesive

• 2-5 mil Thickness Conductive adhesive
• Selectively Applied Adhesive
• Pre cut or Pre Forms
• Post and Pre fab after attachment
• Vertical Machining Center Capability
• DC Resistance measurement Capability

Sweat Soldering

• Temperature range from 165 deg C- 290 deg C Solder.
• Selectively Specified area to be attached.
• Complex Board connection with metal carrier.
• Metal Coins at power transistor area.
• Metal back board attached to base plate.

High Count Layers Ceramic filled Multilayer Boards (Certified MIL-PRF-55110,Type 3)

• 36 Layers Ceramic filled multilayer
• Homogeneous Prepreg
• Precise Layer to Layer Registration
• X-ray measurement Capability for layer movement and layer to layer registration.

Fusion Bonding

• 24 Layers Teflon Fusion Bonding Capability (24" X 24")
• Same Dielectric Constant and Material Properties since fusing the same material as core.
• Good Control with material movement in X,Y & Z directions.

FEP Bonding

• Pure FEP Bonding , Very low loss .0002
• Excellent at high frequency

High Power RF Component Boards

• Up to 0.500" thick multilayer boards
• Cavity to middle layer for RF Connection
• Hole Castellation
• Selective Edge plating for RF Grounding

Printed Antenna on Multilayer Boards

• ±.0005" Line Width Tolerances.
• ± .0005" Spacing Tolerances
• Cavity mount for Circulators.
• Single Side 36" X 100" largest Size board

Back Plane

• Double and Multilayer largest board size 30" X 52"
• Back Plane Layers up to 48
• Largest board size 30" X 52"
• Aspect Ratio of 18:1

Microvia

• Smallest Platted vias 1.9 mil (Laser or Mechanical drilling)
• Via Filled with Non Conductive and Conductive Epoxy
• Vial Plate and Shut.
• Via in Pad with Caps
• 18:1 Aspect Ratio Panel to Drill(Pulse Plating Rectifier)

Blind /Buried Vias

• Blind, Buried vias and Blind/Buried Vias
• Sequential Lamination
• Depth Control drilling/Laser depth control 1:1 Ratio
• Mix Dielectric: Combination of Teflon, Getek, Rogers Duroid 4350, Nelco 400, NL 2000, FR 406 & 408 & many more
• Selective to pocket depth in layers for immediate RF ground for power transistor or metal slugs.

BGA

• 20 mil ball grid array
• 100% electrical testing with Flying Probe or Electrical Fixture.
• With Via in Pad
• With micro vias.

Surface Finisher

• Electroless Nickel and Immersion Gold
• Immersion Tin
• HASL,OSP,Virgin Tin,Bare Copper
• Wire Bondable Gold

Rigid /Flex

• Flex
• Flex Multilayer
• Rigid/Flex

Thin Laminates

• 0.002"- .005"
• Critical Geometry

Single Side Antenna Boards

• up to 96" long board