Delta Circuit's extensive depth and breadth of technical, DFM (design for manufacturing), and DRC (design rules check) support, is aimed to please all our clients.
RF Materials
ROGERS 4000 Series (4003, 4350)
36 Layers
Homogeneous Dielectric Constant
Rogers 3000 Series
24 Layers
Fusion Bonding
Rogers 6000 Series
24 Layers
Fusion Bonding
Roger RT/duroid Series (5880,6002)
16 Layers
Fusion/FEP
Rogers 6035HTC
ROGERS TMM
Per Request
Combined with other materials
Arlon DiClad
Per Request
Combined with other materials
Arlon Cu Clad
Per Request
Combined with other materials
Arlon TC 600, TC 350
Per Request
Combined with other materials
Arlon AD Series
Per Request
Combined with other materials
TACONIC TSM DS (TSM ds 32)
Per Request
Combined with other materials
TACONIC RF Series (RF 35, RF 60)
Per Request
Combined with other materials
TACONIC TLC, TLY, TLX)
Per Request
Combined with other materials
Advanced RF Materials
Ultralem 3000
24 Layers
Homogeneous prepreg
Ultralem 2000
24 Layers
Homogeneous prepreg
ISOLA Astra
24 Layers
Homogeneous prepreg
ISOLA I-Tera
24 Layers
Homogeneous prepreg
High Speed Digital Materials
Megtron 6
36 Layers
Megtron prepreg or combination
GETEK
36 Layers
Nelco 9000 Series
36 Layers
Hitachi 679G
36 Layers
ISOlA 370 HR
36 Layers
ISOLA 408 HR
36 Layers
Conductive Epoxy( Electrically and Thermally Conductive)
Cool Span
Henkel
Precision Silicon
Sweat Soldering (Many Alloys)
ORMET
Unique Materials and Capabilities
Metal Back
Multilayer/DS
Selective Metal Slugs
Fusion Bonding
Conductive Epoxy
Foam (ROHACELL and AIREX)
Buried Component
Ohmega Ply resistive/capacitor foil
Ticer Resistive foil
3M ECM (Capacitance material)
Advance Bond Ply
4450F & 4450B
FEP
FUSION Bonding
2929 Bond Ply
Fast Rise
3001 Bonding Film
Advance Bond Ply
12" X 18"
10" X 16"
16" X 18"
14" X 16"
18" X 24"
16" X 22"
22" X 24"
20" X 22"
24" X 30"
22" X 28"
24" X 36"
22" X 34"
28" X 46"
26" X 46"
32" X 56"
30" X 54"
Single and Double Side 32" x 96"
30" X 94"
Laminate Thickness
Thin Board Thickness
0.002"
Thin Board Thickness / Blind or Buried Vias
0.0025"
with PTH
Max thickness of Multilayer Bd
0.375"
with Blind/Buried
Special Thickness
0.5"
Special Process
Mechanical Drilling Capabilities
Smallest Holes diameter( 10:1 Ratio)
.0034"
Drill hole repeatabilities
.0003"
Largest holes routed
No limits
Runnouts
<.0002"
Minimum clearance from conductor to edge of the hole
.006"
Plated through holes with minimum copper thickness of .001" (18:1 Ratio)
Board thickness .020
.0019" Finished hole
Board thickness .040
.0032" Finished hole
Board thickness .060-.400
18:1 Ratio
Laser Microvia(Via) Capabilities
Smallest Laser Via
.002"
Largest Laser Via
.012"
Depth to Diameter ratio
1:01
Capture Pad Size
.006"+Via
Landing Pad Size
.006"+Via
Copper Filled microvias
<.004"
Stacked Via
Yes
Blind / Buried Vias
Minimum Finished Via Holes Diameter
.0019"
Filled with prepreg
Minimum Finished Via Holes Diameter
.004"
Filled with Epoxy (Non Conductive)
Epoxy Fill Via Holes Aspect Ration max
14:1 Ratio
Type of Via Fill
Via fill with prepreg
14:1 Ratio
Via fill LPI
12:1 Min Fill 50%
Non Conductive Via fill
14:1 Ratio
Conductive Fill
10:1 Ratio
Copper Filled Micro Via minimum
.003"
Copper Filled Micro Via maximum
.006"
Ormet Fill
Via In Pad with Cap plating
Yes
Back Drill Capabilities
Depth Control Tolerance
.005"
Minimum Drill Size
.010" + Via
Typical Drill Size
.020" + Via
Minimum Die Electric Separation
.008"
Minimum Back Drill Dia.
.020" or .010" + Via
Thermal Management Capabilities
Metal Back
Variety of RF Material with backing of Copper, Aluminum, Brass and Copper Moly Copper
Minimum Metal
.005"
Maximum Metal
.5"
Selective Coin Attachment power transistor
Via fill for Heat Transfer
Base Plate or Coin Attachment Materials
Sweat Soldering (6 diff. Alloys)
114°C-288°C
Conductive adhesive thickness
.002"-.004"
DC resistance
.08-.12 Ohm
Thermally Conductive Adhesive
.35w/k-1.22w/k
Thermally Conductive Epoxy
Mechanical Riveting
Mechanical Counter Shink with Screw
.098"-.327" dia
Mechanical Counter Bore with Screw
.098"-.285" dia.
Surface Finish Capability
Immersion Silver
Yes
Electroless Nickel and Gold
Yes
Electrolytic Nickel and Gold
Yes
Electrolytic Tin (Bright Tin)
Yes
Immersion Tin
Yes
Wire Bondable Gold
Yes
Copper
Yes
Hot Air Leveling
Yes
Solder Mask and Legend
Min LPI Solder mask clearance
0.002"
Min Solder dam width
0.003"
LPI Standard Thickness (Cure)
.001"-.0015"
Dry Film Solder mask
Yes
Dry Film Thickness
.002"-.004"
Via fill LPI Cap
Yes
Colors LPI
Blue, Green, Red, Black, White, Yellow, Clear
Minimum Legend width
0.003"
Featured Size Capabilities
Line width tolerances
.00025"/1/ 4oz.
.0005"/1/2 oz.
.00075"/1 oz.
.00125"/2 oz.
.0005"/1/2 oz.
.00075"/1 oz.
.00125"/2 oz.
Spacing
Minimum spacing .0015"
1/4 oz.
Minimum spacing .002"
1/2 oz.
Line width 1/2 oz.
.0003"
Line width 1 oz.
.0045"
Line width 2 oz.
.005"
Line width 3 oz.
.009"
Internal pad size
drill size + .012
Internal isolation
drill size + .022
Layer Registration
on same layer, back to back
0.0005"
layer to layer lamination
0.003"
Testing Capabilities
Minimum Test Continuity Resistance
.1 Ohm
Maximum Test Voltage
1000V
Typical Test Voltages
200-500V
Maximum Isolation resistance
25 M Ohm-1G
Largest test fixture
22" x 39"
Largest test flying probe
24" x 24"
Fixture test pitch
.020"
Flying probe test pitch
.004"
Other Capabilities
TDR (Single and Differential pair)
Yes
LOW DC Measurement for Conductive Epoxy
Yes
Testing
Thermal Conductivity Measurement
Yes
RF Component Coupling, Power divider
Yes
X-Ray Fluorescent measurement for metal
Yes
X-Ray measurement for layer alignment
Yes
X-Ray feature measurement
Yes
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